Wed. Oct 27th, 2021

The CEO of Intel Corporation (NASDAQ: INTC), Pat Gelsinger, stated that the shortage of chips could continue until 2023.

The CEO estimated that it would take two years to rebuild its capabilities

“It could take a year or two to return to a reasonable balance of supply and demand in the semiconductor business,” Pat Gelsinger, Intel’s CEO, said in a conversation with The Wall Street Journal after Thursday’s corporation showed second quarter revenue.

Gelsinger reiterated his remarks about the scarcity he made in a vocation exhibition in May. “Our conjecture is that maybe two years ago the company struggled to do that because, as you say, it takes a while to build a montage or a fabulous one, as we like to call it in trade,” he added. .

The shortage, which has shaken carmaking and instigated supply chain issues for other companies, including customers ’mobile phones and microelectronic products, is a consequence of the displacement produced by COVID-19. In addition, companies shut down manufacturing services in the early days of the epidemic, making it difficult for them to keep up with the growing demand for desired yields while protecting their home.

The newspaper claimed that Intel could increase chip manufacturing through a possible purchase of GlobalFoundries for about $ 30 billion. Gelsinger declined to comment through a consultation call in the afternoon. “At this stage, we wouldn’t say the merger and acquisition is acute, but we wouldn’t dictate it either,” Gelsinger said. “Our view is that an industrial merger is likely to occur.”

Intel and QUALCOMM, Inc. (NASDAQ: QCOM) register a chip production contract

Intel and QUALCOMM, Inc. (NASDAQ: QCOM) have registered a new chip production contract that will result in Qualcomm and Amazon be the first customers of Intel’s new Foundry Facilities business. The company behind the Snapdragon chipsets will get its Intel SoCs with its 20A course capacity, which uses the new construction of RibbonFET transistors and involves improved power management.

The nodule is scheduled to be distributed in 2024. After that, Amazon’s web services division (AWS) will rely on Intel’s new IFS packaging explanations, although exact chipsets will not be configured for Amazon. . However, the construction of chipsets and packaging explanations for third-party companies hint at a significant shift in Intel’s corporate plan and increase its goals to regain the top spot in the semiconductor section by 2025.

The company also announced a roadmap for its workstations, counting on a new identification deal for its chipsets that will open with the upcoming 12-generation Alder Lake chips to be issued later this year. year.

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